FILAMENT_RUNOUT_SUPPORT has never been supported in the MK3 branch, and
contains a ton of horrible and unmaintained code that doesn't even
compile anymore.
Since this code is currently polluting a sizable block inside the G0/G1
code block, simply get rid of it.
When XFLASH is not available, allow users to request _online_ crash
dumps by using D23 (since these require active user cooperation).
Once enabled, instead of just rebooting, dump memory directly to
the serial.
As similarly done with EMERGENCY_DUMP, we have two features that can be
enabled:
EMERGENCY_SERIAL_DUMP: enables dumping on crash after being requested
MENU_SERIAL_DUMP: allow triggering the same manually through the support
menu.
Create a gap between the BSS and the stack guard.
Set this gap (STACK_GUARD_MARGIN) to 32 bytes in all variants.
The gap serves two purposes:
- Detect a stack overflow earlier (falsely triggering in overtight
situations is OK!), so that we can hopefully avoid smashing
the heap and have a clean view during the dump.
- Reserve spack space itself for the stack dumping machinery,
which is going to grow the stack even further.
Remove get_stack_guard_test_value() which was unused.
Prevent bad readings/issues if someone changes the bed thermistor that is "better" with lower min values and creates a custom firmware.
The firmware will now be in the range of the PINDAv2 thermistor independant from the bed thermistor (which may change and need adjustments)
- Changed DETECT_SUPERPINDA to SUPERPINDA_SUPPORT as on miniRAMo the thermistor readings below 30°C
aren't accurate egnough to determine if SUPERPINDA is connected or not
- Add LCD toggle menu Settings -> HW Setup -> SuperPINDA [Yes/No] to overwrite SuperPINDA detection
- If EEPROM_PINDA_TEMP_COMPENSTATION is empty = 0xff then detect SuperPINDA by checking thermistor
- If EEPROM_PINDA_TEMP_COMPENSTAION is 0 then forec enable for temperature compensation menues and functions
- If EEPROM_PINDA_TEMP_COMPENSATION is 1 then force disable for temperature compensation menues and functions
