Instead of having to guess the PC where the SP was sampled, always take
both. This allows "seamless" stack decoding for both serial and xflash
dumps, since we don't have to guess which function generated the dump.
Make the core functions (doing the sampling) be ``noinline`` as well,
so that they always have valid frame.
Save SP which is closest to the crash location, which simplifies
debugging. For serial_dump, write SP just before the dump.
For xfdump, save SP in the dump header.
This makes xfdump_dump and xfdump_full_dump_and_reset() equivalent for
stack debugging.
Now that the stack_error function is truly minimal,
we can check for stack errors much more frequently.
Also move away stack_error from ultralcd to Marlin_main.
Rename EEPROM_CRASH_ACKNOWLEDGED to EEPROM_FW_CRASH_FLAG.
Use EEPROM_FW_CRASH_FLAG to always set the last crash reason, which
simplifies handling between the online/offline variants.
Make stack_error safe, by setting the flag and restarting immediately,
so that the error can be shown after restart.
When XFLASH is not available, allow users to request _online_ crash
dumps by using D23 (since these require active user cooperation).
Once enabled, instead of just rebooting, dump memory directly to
the serial.
As similarly done with EMERGENCY_DUMP, we have two features that can be
enabled:
EMERGENCY_SERIAL_DUMP: enables dumping on crash after being requested
MENU_SERIAL_DUMP: allow triggering the same manually through the support
menu.
Create a gap between the BSS and the stack guard.
Set this gap (STACK_GUARD_MARGIN) to 32 bytes in all variants.
The gap serves two purposes:
- Detect a stack overflow earlier (falsely triggering in overtight
situations is OK!), so that we can hopefully avoid smashing
the heap and have a clean view during the dump.
- Reserve spack space itself for the stack dumping machinery,
which is going to grow the stack even further.
Remove get_stack_guard_test_value() which was unused.
As suggested by @3d-gussner, announce to the host that a dump is
available for retrieval using an action "dump_available".
Any kind of dump is announced (even if manually triggered).
To avoid reading from xflash twice, remove some duplication and return
the crash reason directly in xfdump_check_state().
If MENU_DUMP is enabled, a new entry at the end of the "Support" menu is
added that allows to dump memory for offline use.
This allows to trigger a memory dump at any moment during regular usage
(either idling or printing) and to recover the dump later even after a
hardware reset.
If EMERGENCY_DUMP is defined, crash and dump using the new xflash dump
functionality instead of just continuing with an error message.
When an emergency crash is stored, the first restart after a crash
displays a message that debug data is available and to contact support
to submit the crash for analysis.
This requires expanding the dcode_core address type to 32bit type,
thus enlarges the D2/D3 implementation as a result.
Still allow to save all the original space if D6 is disabled, for now.
Allow to read up to 0x21ff, which is the last byte of SRAM. Set default
starting address to 0x200, which is the first true byte.
0x0-200 is mapped to register/io space and could cause issues when read
from bi-directional registers.
Farmers want to abuse a bug from the previous firmware releases
- they need to see the filename on the status screen instead of "Wait for user..."
So we won't update the message in farm mode...
Check for lcd_draw_update to see if the lcd has been altered outside the
function and redraw the screen if full.
This fixes scenarios such as #3129 where the "Card removed" message or
the SD menu is entered from outside the function's control.
This requires checking/resetting bFilamentWaitingFlag carefully to avoid
re-entering this function _twice_ (raise_z_above will run the main
loop until complete).
Scale extruder motor current linearly with speed.
49% less heating when running at low speed and standstill, 4% more torque at maximum extrusion rate (15mm^3/s), 15% more torque in high speed movements (un/retractions).
StealthChop mode is used for low speeds (below 900mm/min)
spreadCycle is used above. Transition speed is well above maximum extrusion rate of 15mm^3/s (275mm/min) so mode transition is not expected to be visible on printed surface.
StealthChop is expected to improve printed surface quality (less artifacts).
Warning you can burn extruder motor if it is not the same impedance as original Prusa i3 Extruder stepper motor. There is no current feedback in low speed so lower impedance motor can be burned by over current.
Even there is no direct current feedback, there is no risk for original motor thermal runaway, as motor resistance increases with temperature, current decreases.
Standstill peak phase current is expected to be 500 mA and linearly increase with speed to 970 mA at 900mm/min where spreadCycle constant current regulation takes over and keeps peak current at 805 mA to maximum speed possible.
As motor heating increases with current squared, lowering low speed current from 700mA to 500mA decreases heating 49% in thate mode, where motor spends most of the time.
Enable E-motor cool mode in farm mode only (and experimental menu) - the experimental menu is visible AND the EEPROM_ECOOL variable has a value of the universal answer to all problems of the universe - i.e. two conditions must be met at the start of the FW to enable the E-cool mode. If the user enables the experimental menu, sets the E-cool mode and disables the menu afterwards, on the next start of the FW the E-cool mode will be DISABLED. This is still subject to discussion how much obscure (security through obscurity) we'd like this option to have .
Additional stuff:
* Add serial debug msg to verify if E-cool mode is on
* Avoid access to E-cool mode switch on machines without TMC2130
* Do not allow only M907 E in case of E-cool mode+warn the user on the serial line that the command was skipped
Co-authored-by: D.R.racer <drracer@drracer.eu>
